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TN4033A TN4033A C TO-226 B E PNP General Purpose Amplifier This device is designed for general purpose amplifier and switching applications at currents to 500 mA and collector voltages up to 70V. Sourced from Process 67. Absolute Maximum Ratings* Symbol VCEO VCBO VEBO IC TJ, Tstg Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current - Continuous TA = 25C unless otherwise noted Parameter Value 80 80 5.0 1.0 -55 to +150 Units V V V A C Operating and Storage Junction Temperature Range *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. NOTES: 1) These ratings are based on a maximum junction temperature of 150 degrees C. 2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations. 3) All voltages (V) and currents (A) are negative polarity for PNP transistors. Thermal Characteristics Symbol PD RJC RJA TA = 25C unless otherwise noted Characteristic Total Device Dissipation Derate above 25C Thermal Resistance, Junction to Case Thermal Resistance, Junction to Ambient Max TN4033A 1.0 8.0 125 50 Units W mW/C C/W C/W 1997 Fairchild Semiconductor Corporation TN4033A PNP General Purpose Amplifier (continued) Electrical Characteristics Symbol Parameter TA = 25C unless otherwise noted Test Conditions Min Max Units OFF CHARACTERISTICS V(BR)CEO V(BR)CBO V(BR)EBO ICBO IEBO Collector-Emitter Sustaining Voltage* Collector-Base Breakdown Voltage Emitter-Base Breakdown Voltage Collector-Cutoff Current Emitter-Cutoff Current IC = 10 mA, IB = 0 IC = 10 A, IE = 0 IE = 10 A, IC = 0 VCB = 60 V, IE = 0 VCB = 60 V, IE = 0, TA = 150C VEB = 5.0 V, IC = 0 80 80 5.0 50 50 10 V V V nA A A ON CHARACTERISTICS hFE DC Current Gain IC = 100 A, VCE = 5.0 V IC=100mA, VCE=5.0V,TA = -55C IC = 100 mA, VCE = 5.0 V IC = 500 mA, VCE = 5.0 V IC = 1.0 A, VCE = 5.0 V IC = 150 mA, IB = 15 mA IC = 500 mA, IB = 50 mA IC = 150 mA, IB = 15 mA IC = 500 mA, VCE = 0.5 V 75 40 100 70 25 300 VCE(sat) VBE(sat) VBE(on) Collector-Emitter Saturation Voltage Base-Emitter Saturation Voltage Base-Emitter On Voltage 0.15 0.5 0.9 1.1 V V V V SMALL SIGNAL CHARACTERISTICS Cobo Cibo hfe Output Capacitance Input Capacitance Small-Signal Current Gain VCB = 10 V, IE = 0, f = 1.0 MHz VEB = 0.5 V, IC = 0, f = 1.0 MHz IC = 50 mA, VCE = 10 V, f = 100 MHz 1.0 20 110 4.0 pF pF SWITCHING CHARACTERISTICS ts ton tf Storage Time Turn-On Time Fall Time IC = 500 mA, IB1 = IB2 = 50 mA IC = 500 mA, IB1 = 50 mA IC = 500 mA, IB1 = IB2 = 50 mA 350 100 50 ns ns ns *Pulse Test: Pulse Width 300 s, Duty Cycle 1.0% NOTE: All voltages (V) and currents (A) are negative polarity for PNP transistors. TN4033A PNP General Purpose Amplifier (continued) Typical Characteristics 300 V CE = 5V V CESAT - COLLE CTOR-EMITTER VOLTAGE (V) TYPICAL PULSED CURRENT GAIN Typical Pulsed Current Gain vs Collector Current 250 200 150 100 50 0 0.1 25 C 125 C Collector-Emitter Saturation Voltage vs Collector Current 0.6 = 10 0.4 25 C 125 C 0.2 - 40 C - 40 C FE- h 0.3 1 3 10 30 100 300 I C - COLLECTOR CURRENT (mA) 1000 10 100 I C - COLLECTOR CURRENT (mA) 1000 V BE(O N)- BASE-E MITTER ON VOLTAGE (V) V BESAT - BASE-EMITTER VOLTAG E (V) Base-Emitter Saturation Voltage vs Collector Current 1.2 = 10 Base-Emitter ON Voltage vs Collector Current 1 VCE = 5V 1 - 40 C 0.8 - 40 C 0.8 25 C 125 C 0.6 25 C 0.6 0.4 125 C 0.4 10 IC 100 - COLLECTOR CURRENT ( mA) 1000 0.2 0.1 1 10 I C - COLLECTOR CURRENT (mA) 50 Collector-Cutoff Current vs Ambient Temperature I CBO - COLLECTOR CURRENT (nA) 100 V CB = 50V Collector-Base and Emitter-Base Capacitance vs Reverse Bias Voltage 500 f = 1.0 MHz CAPACITANCE (pF) 200 100 50 20 10 C ibo 10 1 0.1 C obo 25 50 75 100 125 T A - AMBIENT TE MPE RATURE ( C) 150 6 0.1 1 10 REVERSE BIAS VOLTAGE (V) 50 TN4033A PNP General Purpose Amplifier (continued) Typical Characteristics (continued) Switching Times vs Collector Current 240 V CE = -10V Turn On and Turn Off Times vs Collector Current 500 t off 400 TIME (ns) 300 200 100 0 10 I B1 = I B2 = I C V CC = - 30V 10 200 TIME (ns) 160 120 80 40 0 V CE = -1.0V t on 100 500 I C - COLLECTOR CURRENT (mA) 1000 1 2 20 100 I C - COLLECTOR CURRENT (mA) 200 Power Dissipation vs Ambient Temperature 1 PD - POWER DISSIPATION (W) TO-226 0.75 0.5 0.25 0 0 25 50 75 100 TEMPERATURE ( o C) 125 150 TO-226AE Tape and Reel Data TO -226AE Packaging Conf iguratio n: Fi gur e 1.0 TAPE and REEL OPTION FSCINT Label sampl e FAIRCHIL D S EMICONDUCTOR CORPORATION L OT: S e Fig 2 e .0 for va rious HTB:B 10000 Reeli g Styles n CBVK741B019 QTY: NSID: PN2222N SP EC: FSCINT SP EC RE V: QA REV: D/C1: D9842 B2 Labe l 5 Reels per Int er med iate B ox (FSCINT) F63TNR Label s ampl e LOT: CBVK7 41B019 QTY: 2000 Cus tom ized Labe l F63TNR Labe l Cus tom ized FSID: PN222N SPEC: D/C1: D9842 D/C2: QTY1: QTY2: SPEC REV: CPN: N/F: F (F63TNR)3 Labe l 375m m x 267m m x 375mm Int er med iate B ox AMMO PACK OPTION S e Fig 3 e .0 for 2 Ammo Pack Option s TO-226AE TNR/AMMO PACKING INF R O MATION Packing Reel Style A E Qua ntity 2,000 2,000 2,000 2,000 EOL code D26Z D27Z D74Z D75Z Am m o M P FSCINT Labe l 327m m x 158m m x 135mm Im med iate B ox 5 A mm o box es per Int er med iate B ox Uni t wei gh t Reel weig ht wi th c om po nents Amm o weig ht wi th c omp on en ts = 0.300g m = 0.868 k g = 0.880 k g Cus tom ized Labe l Max q uanti ty p er i nte rm ed iate b ox = 10,000 un its Cus tom ized Labe l F63TNR Bar c ode Label 333m m x 231m m x 183mm Int er med iate B ox BULK OPTION S e Bulk P e acking Informat ion tabl e Anti -stati c FSCINT Bar c ode Label (TO-226AE ) BULK PACKING INFORMATION LEADCLIP DIMENSION NO L EAD CLIP NO L EAD CLIP NO L EADCLIP Bub ble Sheets EOL CO DE J18Z J05Z NO EOL CODE DESCRIPTION TO-18 OPTION STD TO-5 OPTION STD QUANTITY 1.0 K / BOX 1.0 K / BOX 1.5 K / BOX 1,500 un its per EO70 box for s td o pti on 114m m x 102m m x 51mm EO70 Im mediate B ox TO-226 STANDARD STRAIGHT 5 EO70 boxes pe r Int er med iate B ox 530m m x 130m m x 83mm Inter med iate box Cus tomized Label FSCINT Labe l 7,500 un its m axim um per interm edi at e box for st d opt ion (c)2000 Fairchild Semiconductor International October 1999, Rev. A1 TO-226AE Tape and Reel Data, continued TO-226AE Reeling Style Configuration: Fi gure 2.0 Machine Option "A" (H) Machine Option "E"(J) Style "A" D26Z, D70Z (s/h) Style "E" D 27Z, D71Z (s/h) TO-226AE Radial Ammo Packaging Configuration: Fi gure 3.0 FIRST WIRE OFF IS EMITTER (ON PKG. 92) FIRST WIRE OFF IS COL LECTOR (ON PKG. 92) ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON TOP ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON BOTTOM ORDER STYLE D74Z (M) ORDER STYLE D75Z (P) FIRST WIRE OFF IS EMITTER ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON BOTTOM FIRST WIRE OFF IS COL LECTOR ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON TOP October 1999, Rev. A1 TO-226AE Tape and Reel Data, continued TO-226AE Tape and Reel T aping Dimension Configuration: Fi gur e 4.0 Hd P Pd b Hb W1 L H1 HO L1 S d WO W2 W t t1 P1 F1 DO P2 ITEM DESCRI PTION Base of P ackage to Le ad Bend Componen Height t Lead Clinch He ight Component Base Heig ht Componen Alignm t ent (s ide / side ) Componen Alignm t ent ( front/bac ) k Componen Pitch t Feed H ole P itch Hole Center to First Lead Hole Center to C omponen C t enter Lead Spread Lead T hickness Cut Le ad Length Taped L ead Le ngt h Taped L ead T hicknes s SYM BOL b Hb HO H1 Pd Hd P PO P1 P2 F1/F2 d L L1 t t1 W WO W1 W2 DO S DIMENSION 0.098 (max) 1.078 ( +/- 0. 050) 0.630 ( +/- 0. 020) 0.748 ( +/- 0. 020) 0.040 (max ) 0.03 (max 1 ) 0.500 ( +/- 0. 020) 0.500 ( +/- 0. 008) 0.150 (+0.009, -0.010 ) 0.247 ( +/- 0. 007) 0.104 ( +/- 0 . 010) 0.018 (+0.002, -0.003) 0.429 (max ) 0.209 (+0.05 -0.052 1, ) 0.032 ( +/- 0. 006) 0.02 ( 1 +/- 0. 006) 0.708 (+0.02 -0.019) 0, 0.236 ( +/- 0. 012) 0.035 (max ) 0.360 ( +/- 0. 025) 0.157 (+0.008, -0.007) 0.004 (max ) PO User Direction of Feed TO-226AE Reel Configuration: Fi gur e 5.0 Carrier T ape Thickness Carrier Tape W idth Hold - down T ape W idth Hold - down T ape position Feed H ole P osition Sprocket Hole Diam eter Lead Spring O ut E LE CT ROS TA TIC S EN SI TIV E D EV ICE S Note : All d imensions ar in inches. e D4 D1 ITEM D ESCRIPT IO N SYMBO L MINIMUM MAXIMUM F63TNR Label D2 Reel Diamet er Arbor H ole Diam eter (Standard) D1 D2 D2 D3 D4 W1 W2 W3 13 .975 1.160 0. 0 65 3. 0 10 2. 0 70 0.370 1.630 14 .025 1.200 0.700 3.300 3.100 0.570 1.690 2.09 0 Custom ized Label (Small H ole) Core D iam eter Hub R ecess Inner Diam eter Hu Recess Dept h b Flange to F lange Inner W idth W1 Hu b to Hu b Cente r W idth W3 W2 Note: All dimensions are inches D3 October 1999, Rev. A1 TO-226AE Package Dimensions TO-226AE (FS PKG Code 95, 99) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.300 S4.70-4.32; S1.52-1.02; 2" TYP S7.87-7.37; S7.73-7.10; S1.65-1.27; 2" TYP 0.51 S0.760.36; S15.61-14.47; S0.51-0.36; S0.48-0.30; S1.401.14; S1.40-1.14; PIN 99 E B C 95 E C B S4.45-3.81; 1 5" TYP 2 3 1 2 3 TO-226AE (95,99) S2.41-2.13; For leadformed option ordering, refer to Tape & Reel data information. October 1999, Rev. A1 (c)2000 Fairchild Semiconductor International TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DOMETM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM FAST DISCLAIMER FASTrTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM MICROWIRETM OPTOLOGICTM OPTOPLANARTM PACMANTM POPTM PowerTrench QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM SILENT SWITCHER SMART STARTTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM UHCTM VCXTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. G |
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